The deadline is May 31, 2022 for submitting abstracts for the 14th IEA Heat Pump Conference

The upcoming conference offers an excellent meeting place and will serve as a forum to discuss the latest heat pumping technologies and applications and to exchange knowledge in research, market, policy, and standards information on related technologies. Exhibitions will be held at the conference, to share products and technologies.

Submit your abstracts on the conference website www.hpc2023.org covering the conference theme “Heat Pumps – Resilient and Efficient” (250 words maximum). The abstracts will be screened and authors will be advised of acceptance by June 15, 2022.

Important dates are given below.

• Abstract submission due 15 May  2022  New Deadline:  31 May 2022
• Full paper submission due 15 November 2022
• Final paper submission due 15 February 2023

The 14^th IEA Heat Pump Conference will be held in Chicago, Illinois, May 15-18, 2023.

About the conference
Clean, efficient, and reliable energy systems are essential to meeting basic needs for comfortable, secure, and environmentally friendly building environments; food processing, transport, and storage; and industrial processes. Many analysts estimate that it will not be possible to achieve long-term climate, security, and energy goals without increasing the use of renewable heating and cooling hand in hand with large-scale refurbishment and renovation of the world’s existing buildings and industrial infrastructure.

Proceedings from the last Conference in Jeju

As a service HPT TCP present all proceedings (full papers) from the last conference, free of charge. You find them all in the HPT Publication database https://heatpumpingtechnologies.org/publications/

Highlights from the 13^th Heat Pump Conference

Please find the highlights of the 13^th Heat Pump Conference summarized in Magazine no 2/2021